Active Thermal Control
for High-Power IC Testing
“Achieve tighter characterization and higher test accuracy with a BSE ATC solution engineered for rapid response and exceptional thermal stability.”
Active Thermal Control
“Achieve tighter characterization and higher test accuracy with a BSE ATC solution engineered for rapid response and exceptional thermal stability.”
Boston Semi Equipment (BSE) offers multiple Active Thermal Control (ATC) systems that can be integrated into our engineering fixtures and handlers, high-volume pick-and-place handlers and system level test handlers. This holistic approach allows you to better predict and improve yields, especially when transferring from labs to high-volume manufacturing test floors with the same thermal solution.
Unlike other solutions that only use heater or chuck temperature feedback, our system can be configured to reference more accurate values, such as the junction temperature (Tj) of the device under test (DUT). Some applications may also require a more proactive approach, including the ability to adjust the temperature preemptively based on power signals entering the DUT. Multiple thermal interface materials are also available.
Our ATC solutions are standard in several BSE systems and available as an option in others that require medium- to high-power heat dissipation during testing.
- Ambient-Hot and Tri-Temp Solutions
- Final Test and System Level Test
- Up to 1,550W Per Site
- Multiple Feedback Options
