BSE-300 Device Characterization Pick-and-Place (PnP) Handler
“The BSE-300 Series provides more reliable test data by leveraging the same technology as its high-volume counterpart while maintaining the accessibility and ease of use expected from a laboratory tool.”
BSE-300 Series
“The BSE-300 Series provides more reliable test data by leveraging the same technology as its high-volume counterpart while maintaining the accessibility and ease of use expected from a laboratory tool.”
The BSE-300 Series Engineering Pick-and-Place Handler supports today’s complex device-testing requirements in a compact, lab-friendly footprint. Built for flexibility and precision, it is ideal for engineering development, characterization and low-volume production.
Engineered to handle a wide range of device sizes – from 2x2mm packages to 80x80mm components – the BSE-300 Series offers dual-site capability with impressive throughput, making it a powerful yet space-efficient solution. Its fully automated JEDEC tray feeders enable seamless loading and unloading, while multiple vision options provide for full device traceability.
The system accommodates full-size test heads typically used with production-scale handlers, allowing test engineers to replicate production conditions during development and trust that their test solutions will scale effectively.
The BSE-300 Series also includes our Active Thermal Control unit for consistent thermal performance. Rapid time-to-temperature setup transitions move from ambient to extreme hot or cold temperatures in under 20 minutes. A built-in pretest soak area ensures that devices reach the desired test temperature before insertion to achieve performance accuracy and test repeatability.
- Single and Dual Test Sites
- 2×2 Up to 80x80mm Devices
- Up to 920 Units Per Hour
- Thermal Range: -55oC to 155oC
- Mechanical Refrigeration (No LN2)
- Active Thermal Control Up to 1,550W
- Standard Test Height: 1,020mm
- Vision Options: Pin 1, 2D Code, OCR
